Wafer Automatic Optical Inspection Equipment —— Wafer Optical Inspection
 SOI500/10A |
The AOI series optical defect inspection systems are designed for fully automated pattern inspection, identifying and classifying defects while delivering improved process control capability. The AOI tools are widely used by leading front-end chipmakers and Advanced Packaging manufacturers. The SOI500 provides fully automated optical defect inspection for the Advanced Packaging processes. The SOI600 provides fully automated optical defect inspection for ADI/AEI processes in Front-End-Of-the-Line (FEOL).
Product Features
● Multiple Imaging & Illumination Modes
● Smart Inspection
● Ultra Large FOV
● Low COO
● High Flexibility
● Excellent Resist Residue Inspection
● Off-line Software
Specifications
| Model | SOI500 | SOI510 |
| Resolution | ≥0.5μm | ≥0.5μm |
| Wafer Size | 150mm or 200mm or 300mm | 150mm or 200mm or 300mm |
| Illumination Mode | Dark field and bright field | Dark field and bright field |
| Magnification | 2X, 3.5X, 5X, 10X, 20X |
2X, 3.5X, 5X, 10X, 20X |
| Wafer Stage | X/Y/Rz axis, independent Z axis | X/Y/Rz axis, independent Z axis |
| Scan & Inspection Time | 300mm:130s@3μm 200mm: 76s@3μm |
300mm: 30s@1.43μm 200mm: 20s@1.43μm |
| Model | SOI600 | SOI610 |
| Wafer Size | 200mm or 300mm | 200mm or 300mm |
| Micro Inspection | Auto-photo mode | Auto-photo mode; KLARF File and Review are available; 2X lens photomerge for whole wafer
|
| Magnification | 1X, 2X, 3.5X, 5X, 10X, 20X, 50X, 100X |
1X, 2X, 3.5X, 5X, 10X, 20X, 50X, 100X |
| Macro Front Inspection | Tilt range: -30°~30° | Tilt range: -30°~30° |
| Macro Back Inspection | Backside edge: -5°~180° Backside center: 0°~360°
|
Backside edge: -5°~180° Backside center: 0°~360°
|
| Macro Camera Lens Resolution | 2048×2048 | 2048×2048 |
| Throughput | ≥140WPH |
≥140WPH |
Products
CONTACT US
No.1525 Zhangdong Road Zhangjiang Hi-Tech Park Shanghai
info@smee.com.cn
+86-21-51315131
+86-21-58969020
