Wafer Aligner/Bonder —— MEMS Manufacturing
 SWA Series Wafer Aligner |
 SWB Series Wafer Bonder |
 SWDB Series Wafer Debonder |
The SW series aligner/ bonder / debonder are designed for various types of applications in MEMS, power devices, CMOS image sensor, advanced packaging (3D-TSV, WLP, etc.) and compound semiconductor (LED, RF, etc.). The SWA is for bonding and alignment of different wafers. The SWB covers multiple bonding methods, including adhesive, glass-frit, eutectic and anodic. The SWDB is to meet debonding process requirements.
Product Features
● Flexible Alignment Mode and Application
● High Precision Pressure and Excellent Temperature Control
● Warped Wafer and Ultra-thick Wafer Handling
● Low COO
● Convenient Upgrade Design
Specifications
|
M |
SWA200 |
SWA300 |
|
Wafer Size |
200mm |
300mm |
|
Alignment Mode |
Face to face Alignment |
Face to face Alignment |
|
Alignment Precision |
<±2μm |
<±2μm |
|
Model |
SWB200 |
SWB300 |
|
Wafer Size |
200mm |
300mm |
|
Maximum Contact Force |
5KN（100KN Optional） |
30KN（100KN Optional） |
|
Force Uniformity |
<1% |
<1% |
|
Maximum Temperature |
250℃ (550℃ Optional) |
250℃ (550℃ Optional) |
|
Maximum Vacuum |
<5×10-5 mbar |
<5×10-5 mbar |
|
Anodic Bonding |
0-2000 V/50mA (Optional) |
0-2000 V/50mA (Optional) |
|
Model |
SWDB200/10 |
SWDB300/10 |
|
Wafer Size |
200mm |
200mm/300mm |
|
Maximum Temperature |
300℃ |
300℃ |
Products
CONTACT US
No.1525 Zhangdong Road Zhangjiang Hi-Tech Park Shanghai
info@smee.com.cn
+86-21-51315131
+86-21-58969020
