Wafer Edge Exposure Equipment —— Stripping Photo-resist on the Silicon Wafer Edge

SWEE200/25

SWEE200 is specially designed for stripping photo-resist on the silicon wafer edge in CSP. It supports 200mm and 300mm silicon wafers with a notch or flat edge and has functions such as outer/ inner ring, subsection and straight line exposure. It offers high exposure accuracy and throughput and can be customized to meet various process needs for wafer edge exposure.

● Compatible with 200mm and 300mm wafers with flat or notch edge

● Automatic wafer handling and exposure

● Various exposure functions such as outer/ inner ring, subsection and straight line exposure

● High level of luminosity on wafer surface delivered by powerful lamp

● Modular design with high reliability and easy maintenance

● Customizable