500 Series Stepper —— IC Back-end Advanced Packaging
 SSB500/40 |
 SSB500/50 |
The SSB500 series steppers are designed for 200mm/300mm wafer exposure in the IC advanced packaging field, including Flip Chip, Fan-In WLP, Fan-Out WLP and 2.5D/3D applications, which meet wafer-level packaging requirements in Bumping, RDL and TSV processes.
Product Features
● Excellent Contamination Prevention
● Strong Process Adaptability
● High Precision
● High Throughput
Specifications
|
Model |
SSB500/40 |
SSB500/50 |
|
Resolution |
2μm |
1μm |
|
Light Source |
ghi-line/gh line/i-line mercury |
ghi-line/gh line/i-line mercury |
|
Wafer Size |
200mm/300mm |
200mm/300mm |
|
Options |
IR or visible light backside alignment Wafer edge exposure |
IR or visible light backside alignment Wafer edge exposure |
Products
CONTACT US
No.1525 Zhangdong Road Zhangjiang Hi-Tech Park Shanghai
info@smee.com.cn
+86-21-51315131
+86-21-58969020
